Wafer Sputtering Coating Dicing Probing and More

KOH YOUNG TECHNOLOGY KY-3020T 3D SOLDER PASTE INSPECTION SYSTEM

YIELD ENGINEERING SYSTEMS YES-CV200RFS PLASMA CLEANER STRIP/DESCUM SYSTEM

YIELD ENGINEERING YES-CV200RF PLASMA STRIP/DESCUM WAFER CLEANING SYSTEM

MUHLBAUER DS VARIATION W2J DIE SORTER PICK & PLACE IC HANDLING MACHINE

200MM THERMOCHUCK WAFER PROBER, OPTEM A-ZOOM

TRION TECHNOLOGY MINILOCK II PLASMA ETCH RIE REACTIVE ION ETCHER (MNLII)

PLASMA-THERM 790 8" PECVD MF PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION

KEITHLEY 7001 SWITCH SYSTEM, QTY 2 KEITHLEY 7011-S QUAD 1X10 MULTIPLEXER CARDS S/N: 0763471

THE HEAT SOURCE INC MODEL BSI1 VACUUM DRYING OVEN S/N 0165

PERKIN ELMER 2400 ULTEK VACUUM SYSTEM 64"X36"X80" S/N ACM-018

CVC PRODUCTS INC 601 SPUTTERING SYSTEM | 64"X42"X60"

BALZERS BA511 EVAPORATION SYSTEM | 55"X48"X87"

2400-8L ULTEK VACUUM SYSTEM WITH ADVANCED ENERGY MDX10 POWER SUPPLY. 64" X40" X77". ON WHEELS. S/N 9455

KARL SUSS PA200 SEMIAUTOMATIC PROBE STATION WITH CASSETTE LOADER, 200MM THERMAL WAFER CHUCK WITH TEMPTRONIC TPO3000 THERMAL CONTROLLER/CHILLER UNIT. PROBE SHIELD ENCLOSURE PROVIDES EM SHIELDING AND A MINI-ENVIRONMENT FOR THERMAL PROBING. DIGITAL CCD CAMERA VIEWING WITH FIBER OPTIC ILLUMINATOR. INDUSTRIAL COMPUTER WITH WINDOWS XP OS AND PROBER BENCH REV 5.15 PROBER CONTROL SOFTWARE. S/N: 45053

2001 SURFACE TECHNOLOGY SYSTEMS MULTIPLEX REACTIVE ION ETCHER (RIE), S/N 03642. LOAD LOCK SYSTEM WAFER SIZE FROM 3 TO 8 INCH (75MM TO 200MM) CAPABLE; WAFER SET SIZE = 6 INCH (150MM). RIE PROCESS MODULE MESC RIE SC100M PROCESS CHAMBER; VERSION 1.0; PC CONTROLLED; INTELLIMETRICS END-POINT DETECTOR (EPD); ELECTRODE TEMPERATURE CONTROL (+5 TO +40 DEG C); NON-CLAMPED ELECTRODE; ENI ACG3B 300/30 WATT (13.56MHZ) RF SUPPLY & MATCHING UNIT. REMOTE GASBOX WITH 2X PFC1 MODULE. GASSES: (1) O2, (2) AR, (3) CF4, (4) SF6. HUBER UNISTAT 140 CHILLER.

PERKIN ELMER 2400-8L SPUTTERING SYSTEM | M.O. 2400-8LII8 PN 221-958-200 | 64" X52"X80"| WITH POWER SUPPLY

THERMONICS T2425 PRECISION TEMPERATURE FORCING SYSTEM, 220VAC, 15A, 60HZ, 1PH S/N: 8902-0351

2000 MITUTOYO FS50 TRINOCULAR MICROSCOPE WITH WF20X EYEPIECES, MPLAN APO 20X OBJECTIVE LENS, AND MICRO-TECH INSTRUMENTS LIGHT SOURCE. 6-INCH AMBIENT TEMPERATURE WAFER CHUCK. S/N:608180

SAMCO UV300-H ULTRAVIOLET OZONE CLEANER. SUBSTRATE LOADING: EASY, DRAWER-TYPE SLIDE TO LOAD SUBSTRATES. OPERATING PRESSURE: ATMOSPHERIC PRESSURE. CLEANING PROCESS: DRY PROCESS USING UV LIGHT, OZONE AND HEAT TO COMPLETELY CLEAN DELICATE ELECTRICAL CIRCUITS. APPLICATIONS: STRIPPING PHOTORESIST AND POLYIMIDE; INK REMOVAL FROM EPROM WAFERS (WITHOUT ERASING PROGRAMS); REMOVING ORGANIC CONTAMINATION FROM SUBSTRATES PRIOR TO THIN FILM DEPOSITION; PREPARING SURFACE FOR PHOTORESIST; DESCUMMING PHOTORESIST AND E-BEAM RESIST; CLEANING WAFERS PRIOR TO WAFER BONDING. FACILITY REQUIREMENTS: POWER: 115VAC; 1PH; 40A. COOLING WATER: 50-75 DEGREES F; 48-42 PSIG PRESSURE DIFFERENTIAL BETWEEN SUPPLY & DRAIN. PROCESS GASSES: OXYGEN (O2) - 14.2 PSIG; 0-20 SLM FLOW (MAX). PURGE: NITROGEN (N2) - 25 PSIG; 37-50 SLM FLOW. COMPRESSED AIR (TO RAISE & LOWER SUBSTRATE HEATER): 85 PSIG (DRY AIR). VENTING: SHOULD BE TEFLON, STAINLESS STEEL OR ALUMINUM IN CONSTRUCTION; NEGATIVE PRESSURE NOT TO EXCEED 0.2 INCHES OF WATER COLUMN. DIMENSIONS: 27W X 31D X 50H (INCHES). S/N: 20S1121

200MM WAFER TRANSFER TOOL, S/N 453

SEMITOOL SPRAY SOLVENT TOOL, S/N F111210 COMPLETE MODEL NUMBER: SSTF201280F 208VAC, 3PH SINGLE-BOLT ROTOR, 6-INCH (REMOVED AND PACKAGED): A108-50MOD-0215 QTY 2 MANUALS

PRECISION GRAVITY OVEN, TEMPERATURE RANGE: 85-210 DEG C, 1300W, 120VAC, 11.3A, 50/60HZ, 1PH, S/N: 604091567

200MM WAFER TRANSFER TOOL, S/N 474

FISCHER SCIENTIFIC 625G GRAVITY OVEN S/N: 71000227

EXATRON 902 PNP HANDLER, OPERATING SYSTEM: WINDOWS2000 PROFESSIONAL S/N: PNP9020408182

FTS KINETICS LOW TEMPERATURE CHILLER MODEL: RC-0421-A 208VAC, 28A, 60HZ, 3PH S/N: 15067

208 VAC, 60 HZ EBARA 40X20 VACUUM PUMP S/N: DPA987447

2000 ESEC 8003-1 WAFER DICING SAW, S/N 1-62. WAFER DIAMETER: 1IN.-6IN. WAFER THICKNESS: 0.3MIL-196.9MIL. X-AXIS (FEED): 9.45IN. Y-AXIS (INDEX): 6.5IN. INDEX STEP: 0.79MIL-3937MIL. Z-AXIS (VERTICAL): .393IN. ROTATION ANGLE: 0.01-165 DEGREES. SPINDLE SPEED: 15,000-50,000 RPM. POWER REQUIREMENTS: 220VAC, 50/60HZ, 2.5KVA. AIR PRESSURE: 64-85 PSI. WATER PRESSURE: TO 85 PSI.

2000 SEMITOOL SOLVENT TOOL WST306A(1AD) FF 208VAC 3PH SINGLE-BOLT ROTOR 6-INCH INSTALLED FRONT COVER PANEL MISSING S/N: F57335