Semiconductor Probe Test Handling Packaging Peripherals Electronic Test

DELTA DESIGN PYRAMID OR 6200-SERIES AUTOMATED THERMAL TEST HANDLER. AUTOMATED SEMICONDUCTOR DEVICE HANDLER DESIGNED FOR HIGH-THROUGHPUT LOADING, THERMAL CONDITIONING, AND TESTING OF PACKAGED INTEGRATED CIRCUITS DURING ELECTRICAL TEST OPERATIONS. UTILIZING PRECISION ROBOTIC PICK-AND-PLACE MECHANISMS, VACUUM HANDLING, AND TEMPERATURE-CONTROLLED TEST CHAMBERS, THE SYSTEM AUTOMATICALLY TRANSFERS DEVICES BETWEEN INPUT TRAYS OR TUBES AND AUTOMATED TEST EQUIPMENT (ATE), THEN SORTS TESTED COMPONENTS INTO OUTPUT BINS BASED ON PASS/FAIL OR GRADING RESULTS. COMMONLY INTEGRATED WITH ADVANTEST, TERADYNE, AND KEYSIGHT/AGILENT PARAMETRIC AND FUNCTIONAL TEST SYSTEMS FOR PRODUCTION TESTING OF ANALOG, MIXED-SIGNAL, MEMORY, LOGIC, AND POWER SEMICONDUCTOR DEVICES. TYPICAL SPECIFICATIONS: DEVICE TYPES: PACKAGED ICS INCLUDING QFN, BGA, QFP, SOIC, DIP, AND SIMILAR PACKAGE FORMATS LOADING CONFIGURATION: AUTOMATED TRAY AND/OR TUBE HANDLING (CONFIGURATION DEPENDENT) THERMAL TESTING: HOT AND COLD TEMPERATURE CONDITIONING FOR PRODUCTION AND RELIABILITY TESTING TRANSFER SYSTEM: PRECISION ROBOTIC VACUUM PICK-AND-PLACE MECHANISM SORTING: AUTOMATED PASS/FAIL AND MULTI-BIN DEVICE SORTING CONTROL SYSTEM: PLC-BASED MOTION CONTROL WITH COORDINATED SERVO-DRIVEN AXES INTEGRATION: COMPATIBLE WITH ADVANTEST, TERADYNE, KEYSIGHT/AGILENT, AND OTHER ATE PLATFORMS APPLICATIONS: FUNCTIONAL TESTING, PARAMETRIC TESTING, BURN-IN SUPPORT, AND RELIABILITY SCREENING INDUSTRIES: SEMICONDUCTOR MANUFACTURING, DEVICE PACKAGING, ENGINEERING VALIDATION, AND PRODUCTION TEST DESIGNED FOR HIGH-VOLUME SEMICONDUCTOR MANUFACTURING, DELTA DESIGN THERMAL HANDLERS PROVIDE RELIABLE AUTOMATED DEVICE HANDLING, PRECISE TEMPERATURE CONTROL, AND SEAMLESS INTEGRATION WITH INDUSTRY-STANDARD AUTOMATED TEST EQUIPMENT TO MAXIMIZE THROUGHPUT AND TEST EFFICIENCY.

DELTA DESIGN / COHU THERMAL TEST HANDLER (6200/6400 SERIES) AUTOMATED SEMICONDUCTOR THERMAL TEST HANDLER FOR HIGH-THROUGHPUT TESTING AND SORTING OF PACKAGED INTEGRATED CIRCUITS UNDER CONTROLLED TEMPERATURE CONDITIONS. ROBOTIC DEVICE TRANSFER, THERMAL CONDITIONING (HOT AND COLD), AUTOMATED LOADING FROM TRAYS OR TUBES, AND PASS/FAIL BIN SORTING, INTEGRATED WITH LEADING AUTOMATED TEST EQUIPMENT (ATE) FROM AGILENT/KEYSIGHT, TERADYNE, AND ADVANTEST FOR FUNCTIONAL, PARAMETRIC, AND RELIABILITY TESTING OF POWER, MEMORY, MIXED-SIGNAL, AND OTHER SEMICONDUCTOR DEVICES.

2005 SEIKO EPSON NS-8040 HIGH-SPEED IC HANDLER FULLY AUTOMATED, SERVO-DRIVEN SEMICONDUCTOR IC HANDLER DESIGNED FOR HIGH-THROUGHPUT TESTING, SORTING, AND INSPECTION OF PACKAGED SEMICONDUCTOR DEVICES. PRECISION MULTI-AXIS ROBOTICS, VACUUM PICK-AND-PLACE TECHNOLOGY, TRAY HANDLING, AND PLC-BASED MOTION CONTROL, THE NS-8040 AUTOMATES LOADING AND UNLOADING OF DEVICES TO AUTOMATED TEST EQUIPMENT (ATE), SORTS COMPONENTS BY TEST RESULTS, AND SUPPORTS THROUGHPUT OF APPROXIMATELY 4,000-7,000 DEVICES PER HOUR, DEPENDING ON PACKAGE TYPE AND CONFIGURATION. INTEGRATED WITH TEST SYSTEMS FOR FUNCTIONAL AND PARAMETRIC TESTING. POWER INPUT 200-240 VAC (SINGLE PHASE), 50/60 HZ, 6 KVA MAX AIR REQUIREMENT 0.49 MPA (5 KGF/CM2) MAIN MOTORS AC SERVO AXES (400 W - 4, 200 W - 2) + STEPPER Z-AXIS (2 W) TRAY HANDLING ROBOT 100 W AC SERVO MOTOR TRAY LIFT/UNLOAD 6 W INDUCTION MOTOR DIMENSIONS 1700 (W) X 1500 (D) X 1760 (H) MM WEIGHT APPROX. 920 KG BUILD DATE DEC 2005 (LABEL 12.05) CONTROL ELECTRONICS OMRON & SMC MODULES, SERVO AMPLIFIERS, AND PLC LOGIC NETWORK AXES OBSERVED MAIN I/O, TEST ARM (XYZU), TRAY ROBOT, SHUTTLE ARM ALL SERVO DRIVEN TYPICAL THROUGHPUT 4,000 - 7,000 DEVICES/HOUR (DEPENDING ON PACKAGE TYPE AND TESTER)

EPSON NS6040 WAFER/IC HANDLER FULLY AUTOMATED SEMICONDUCTOR HANDLING SYSTEM FROM EPSON'S NS6000 SERIES FOR HIGH-SPEED TESTING, INSPECTION, AND PACKAGING OF SEMICONDUCTOR WAFERS, DIE, AND PACKAGED ICS.